Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material before Accumulative Roll Bonding Processes

Copper is one of the first metals to ever be mined and used by humans, since dawn civilization, it has made important contributions behavioral science. The exploration copper provided knowledge nonfuel minerals consequently improved society. objective this paper investigate effect annealing on microstructure, mechanical properties, corrosion material before undergoing an accumulative roll bonding process (ARB). was heated 600°C cooled with water being rolled a two-roller rolling machine. second ARB experiment conducted without annealing. samples were characterized light microscope (LM). ASTM E384 test method followed during hardness test. results show that applying two passes reduce grain size 37%, which significant. It also increases 65% its electrical conductivity 2.6%. Additionally, open circuit potential pass sample −0.07237 V; increased 22.16% sample.